Microscope optics for chip-level thermal imaging of electronic components and boards
The newly developed Microscope lenses are especially designed for thermal inspection of electronic boards and analyses of small chip level components down to 8 μm. The distance between the measurement object and the camera can vary between 80 and 100 mm (MO44) or 15 mm (MO2X).
Important specifications:
Analysis of small chip level components down to 8 μm
Exchangeable, focusable optics for most flexible use of the c amera
Microscope stand included for hands-free simultaneous operation / testing
Exchangeable, focusable lenses for most flexible use of the camera
With a Temperature resolution (NETD) of 80 mK
Frame rates up to 125 Hz allow inspection of fast processes (like pulsed laser diodes)
Radiometric video or tiff recording with +/-2 °C measurement accuracy
License-free analysis software and complete SDK included
